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(Telematics Wire) NXP Semiconductors announces a new automotive platform for connected, electric and autonomous cars

NXP Semiconductors announces a new automotive platform for connected, electric and autonomous cars

NXP has announced a new automotive processing platform that would help bring the future vehicles to market faster. NXP S32 is an all-new control and compute concept for connected,...

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Baidu joins hands with BAIC Group to mass produce self-driving cars by 2019

Baidu is joining hands with BAIC Group to mass produce self-driving cars by 2019. BAIC Group, a Chinese automaker will take care of the manufacturing part while Baidu will handle...

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MIPI Alliance forms Automotive Birds of a Feather (BoF) Group to solicit industry input from OEMs and suppliers for developing new interface specifications for automotive application

MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced the formation of an Automotive Birds of...

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Velodyne more than quadruples production for its LiDAR sensors to meet strong global demand

Velodyne LiDAR has more than quadrupled production for its LiDAR sensors to meet strong global demand. As a result, Velodyne LiDAR’s sensors are immediately available via...

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IEEE and IEEE-SA form task force to develop standard for greater than 1GB/s automotive Ethernet

In order to meet the demand for higher speed Ethernet in the automotive environment to support ongoing technological developments, such as connected cars, advanced driver assisted...

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