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(Telematics Wire) Qualcomm and Vodafone partnering to develop and test next-generation 5G Open RAN infrastructure

Saietta VNA ramps up its eDrive ‘Make in India’ strategy
Saietta VNA, the joint venture between Saietta Group plc (Saietta) and Padmini VNA, is delivering on its ‘Make in India’ strategy which will see it begin eDrive (electric drive) volume production in the country in 2023.

 

 

Qualcomm and Vodafone partnering to develop and test next-generation 5G Open RAN infrastructure
Qualcomm Technologies, Inc. and Vodafone have a strong, longstanding relationship driving mobile communications innovations in Europe and now the companies announce the next step in that collaboration. By joining forces, the two industry leaders plan to develop, test and integrate next-generation 5G distributed units (DUs) and Radio Unit (RU) with Massive MIMO capabilities, ultimately to deliver the commercial deployment of Open RAN in Europe. 

 

 

Minda Corporation announces Technology License & Assistance Agreement with Daesung Eltec
Minda Corporation Limited, the flagship company of Spark Minda has entered into a technical collaboration with DAESUNG, Korea, the automotive electronics company to bring the Next-Gen Advanced Driver Assistance System (ADAS) solutions to the Indian automotive market.

 

 

CATL and VinFast reach global strategic cooperation to promote global e-mobility
CATL and VinFast announced an MOU for Global Strategic Cooperation to expand collaboration in areas including CIIC (CATL integrated intelligent chassis) skateboard chassis products.

 

 

Opus IVS™ introduces QuickADAS™
Opus IVS™ announced QuickADAS™ that enables a vehicle repair facility to directly perform calibrations on the DriveSafe™ diagnostic platform from the ADAS Checklist.

 

 

Ansys announces the launch of Ansys Gateway powered by AWS
Ansys announced availability of Ansys Gateway powered by Amazon Web Services (AWS), which allows customers to use popular Ansys products in one unique workspace on AWS – helping simplify access to faster, more flexible, and highly scalable engineering solutions.

 

 

 

 

 

 

 

 

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